Model
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TU858
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Processor
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CPU
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● Dual or Quad 1st Gen Intel® Xeon® Scalable Processors 5100/6100/8100 series
● Dual or Quad 2nd Gen Intel® Xeon® Scalable Processors 5200/6200/8200 series
● TDP 85~205W
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Intel® UPI
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● Full Cross Bar
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Chipset
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Intel® C621 chipset
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System Memory
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Memory Capacity
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● 48 DDR4 DIMM slots, 24 memory channels
● DIMM sizes: 8G, 16G, 32G, 64G, 128G, 256G, 512G
● RDIMM/LRDIMM: support up to 128GB(Skylake)/256GB(Cascade Lake)
● Intel® Optane DCPMM: support up to 512GB(Cascade Lake)
● Support up to 18.0TB system memory ( Specific CPU and Intel® Optane DCPMM will be required )
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Memory Type
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● Supports 48 DDR4 RDIMMs/LRDIMMs/NVDIMMs, up to 2933MT/s
● Supports 24 Intel® Optane DCPMMs, up to 2666MT/s
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Internal Storage
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Storage Controller
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● On-Board 6Gb/s SATA controller
● Support 12Gb/s SAS HBA (optional)
● Support 12Gb/s SAS RAID controller (optional)
|
SAS/SATA/NVMe
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● Up to 24 hot-swap 3.5'' SAS/SATA hard drives Or up to 50 hot-swap 2.5'' SAS/SATA hard drives Or up to 16 2.5'' NVMe SSD hard drives (14 hot-swap and 2 non hot-swap)
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M.2
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● Support 2 PCIe M.2 (80/110mm)
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Others
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● Support 2 SATA DOMs and 1 Micro SD card
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Network Interface
|
|
● 2 On-Board 1GbE RJ45 ports
● 1 RJ45 dedicated Ethernet management port
● Optional 2x1GbE/4x1GbE/2x10GbE/4x10GbE/2x25GbE/2x40GbE NIC mezzanine card
● Support various standard PCIe NIC
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Dimension and Weight
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Chassis
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● 4U rackmount
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Height
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● 175mm (6.9'')
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Width
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● 448mm (17.6'')
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Depth
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● 840mm (33.1'') (820mm/exclude hanger)
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Weight
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● Net Weight: 43 kg (94.8 lbs)
● Gross Weight: 62 kg (136.7 lbs) rails, accessories and packing are included
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Operating System Compatibility
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Microsoft Windows Server/Microsoft Hyper-V server/Red Hat Enterprise Linux/SUSE Linux Enterprise Server/CentOS/Ubuntu/Fedora/Solaris/Oracle Linux/FreeBSD/VMware ESXi/Citrix XenServer "Please consult your TTY representative for specific version"
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PCI-E Expansion
|
|
● Up to 15 PCI Express 3.0 slots (Chassis rear) (To be specific)
● 2 Full height half length PCI Express 3.0 x16 Slots
● 4 Full height half length PCI Express 3.0 x8 Slots/one lanex4 among (2 hot-swappable PCIe slots among)
● 1 Full height half length non-standard PCI Express x8 slot for dedicated NIC
● 8 crosswise full height full length PCI Express 3.0 x16 Slots (all are lanex8) (4 each on left and right) Or support 2 PCI-E 3.0 riser cards on each of left and right to enable total 4 double-width FHFL GPU cards instead.
|
Input/Output
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BMC
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● On-Board BMC chip, support remote management, such as IPMI2.0, KVM Over IP, SOL, SNMP etc.
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Software
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● AMI management software, support multiple hosts deployment at the same time or specific deployment according to schedule
● Support monitoring of utilization of CPU, memory etc.
● Support batch log collection etc.
● Remote multi-function advanced management on data center management platform is enabled
● Optional LCD management module
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Security
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Optional TPM security module, intrusion detection while openning chassis, front panel is locking with key, upper cover of chassis is locked
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Power Supply
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● 2 or 3 or 4 PSUs, support 1+1, 2+1, 2+2, 3+1 redundancy and hot-swap
● Optional 110 VAC/220 VAC/240 VDC/336 VDC/-48 VDC
● Opional 800w/1300w/1600w
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System Cooling
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8 8038 fans with N+1 redundancy, support hot-swap
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|
Operating Environment
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Environmental Specs.
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● Standard operating temperature: 5℃~35℃ (41°F ~ 95°F) "no direct sustained sunlight"
● Extended operating temperature: 5℃~40℃ (41°F ~ 104°F) "comply with approved hardware configurations"
● Storage/Transportation temperature: -40℃~65℃ (-40°F ~ 149°F)
● Operating humidity 10%~80% RH (non-condensing)
● Storage humidity 5%~95% RH (non-condensing)
● ASHRAE A3 and A4 compliant
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